[J.18] Near-Infrared Imaging System for Nondestructive Inspection of Micro-Crack in Wafer through Dicing Tape

[J.18] Near-Infrared Imaging System for Nondestructive Inspection of Micro-Crack in Wafer through Dicing Tape

S. -F. Lin, C. -H. Chen, and C. -Y. Lo
Applied Optics, Vol. 54, E123-E128 (2015)

doi:10.1364/AO.54.00E123