Research / System Integration 系統整合

[J. 36] Strain sensor with low thermal conductivity concealing resin for enhanced detection sensitivity and improved spatial resolution

Chi-Hao An, Kuan-Hsun Liao, and Cheng-Yao Lo
Journal of Micromechanics and Microengineering, Vol. 29, 124001 (2019)

doi.org/10.1088/1361-6439/ab45d0