Apr. 27, 2025 Reunion of graduate members during NTHU 114th (PME 53rd, NEMS 23rd) anniversary.
Apr. 27, 2025 Reunion of graduate members during NTHU 114th (PME 53rd, NEMS 23rd) anniversary.
![[J.62] A 3D profiling system using thermoresistive sensing and image processing with stepwise pixel patching](http://printronics.tw/wp-content/uploads/TCLiu.jpg)
[J.62] A 3D profiling system using thermoresistive sensing and image processing with stepwise pixel patching
T. –C. Liu, P. P. Pancham, M. –T. Yuan, Y. –W. Chen, C. –H. Tsai, and C. –Y. Lo Measurement, Vol. 249, 117073 (2025) 10.1016/j.measurement.2025.117073
![[J.59] Integrated Pressure and Proximity Sensors on Silicone and PU substrates that Supports Flexible Hybrid Electronics](http://printronics.tw/wp-content/uploads/Pancham-porosity.jpg)
[J.59] Integrated Pressure and Proximity Sensors on Silicone and PU substrates that Supports Flexible Hybrid Electronics
P. P. Pancham, A. Mukherjee, B. K. Yuan, C. –H. Tsai, P. Yu, and C. –Y. Lo IEEE Journal of Flexible Electronics, Vol. 3, 259-264 (2024) 10.1109/JFLEX.2024.3406288
Nov. 16, 2024 C. C. Wang, C. H. Hung, and Y. W. Chen were recognized as “The First Place” in group E02 in 2024 CSME Annual Conference.
Nov. 16, 2024 C. C. Wang, C. H. Hung, and Y. W. Chen were recognized as “The First Place” in group E02 in 2024 CSME Annual Conference.
P. Pancham was granted “Outstanding semester TA”. 帕滿納獲頒傑出教學助理獎。
Jul. 22, 2024 P. Pancham was granted “Outstanding semester TA”. 帕滿納獲頒傑出教學助理獎。
![[J.58] Integrated Automatic Optical Inspection and Image Processing Procedure for Smart Sensing in Production Lines](http://printronics.tw/wp-content/uploads/RQQiu.jpg)
[J.58] Integrated Automatic Optical Inspection and Image Processing Procedure for Smart Sensing in Production Lines
Rong-Qing Qiu, Mu-Lin Tsai, Yu-Wen Chen, Shivendra Pratap Singh, and Cheng-Yao Lo Sensors, Vol. 24, 1619 (2024) 10.1002/admi.202300029
![[J.56] Thermoresistive Profile Sensing Based on Isotropic Strain Detection with Taiji Pattern Routing](http://printronics.tw/wp-content/uploads/YRYang.jpg)
[J.56] Thermoresistive Profile Sensing Based on Isotropic Strain Detection with Taiji Pattern Routing
Yuan-Ren Yang, Teng-Chung Liu, Yu-Wen Chen, Padmanabh Pundrikaksha Pancham, Gufran Ahmad, Sandipan Mallik, and Cheng-Yao Lo IEEE Sensors Journal, Vo. 24, 9506-9513 (2024) 10.1002/admi.202300029
![[J.54] Machine-learning based characteristic estimation method in printed circuit board production lines](http://printronics.tw/wp-content/uploads/MLTsai.jpg)
[J.54] Machine-learning based characteristic estimation method in printed circuit board production lines
Mu-Lin Tsai, Rong-Qing Qiu, Kuan-Yi Wu, Tzu-Hsuan Hsu, Ming-Huang Li, and Cheng-Yao Lo Flexible and Printed Electronics, Vol. 8, 034001 (2023) 10.1088/2058-8585/ace4db
![[J.52] Strain visualization in flexible sensors with functional materials: A review](http://printronics.tw/wp-content/uploads/pancham-visualization.jpg)
[J.52] Strain visualization in flexible sensors with functional materials: A review
Padmanabh Pundrikaksha Pancham, Wen-Hsin Chiu, Anupam Mukherjee, and Cheng-Yao Lo Advanced Materials Interfaces, Vol. 2023, 2300029 (2023) 10.1002/admi.202300029
![[J.55] Novel Multiaxial Force Decoupling Strategy in Vertically Stacked Force Sensors with Hybrid Fabrication Techniques](http://printronics.tw/wp-content/uploads/JYWu.jpg)
[J.55] Novel Multiaxial Force Decoupling Strategy in Vertically Stacked Force Sensors with Hybrid Fabrication Techniques
Jie-Ying Wu, Tzu-Yi Hsu, Gufran Ahmad, Sandipan Mallik, and Cheng-Yao Lo IEEE Sensors Journal, Vol. 23, 30135-30142 (2023) 10.1109/JSEN.2023.3326310