The Flexible Printronics Lab
Micro and nano printing process is highly expected to replace a part of the conventional photolithography process in the near future for its low cost, high throughput, and easy handling properties. This maskless production technique with three-dimensional structure capability shows very promising solutions for the next generation electronics. In the same time, growing demands on light weight and compact electronic device direct the solutions to thin solid state or polymer substrate material with flexibility. Recent commercial flexible devices such as e-paper, solar cell, RF tag, disposable printed battery, and large area lighting opened great application varieties and attracted diverse attentions.
近年來微米及奈米印刷技術的發展及其在低成本、高產能及易操作上的特性，讓人們期待此技術在可見的將來能取代部份的傳統式微影製程。這些無光罩印刷技術因為能直接製作立體結構圖樣，所以也被人們認為是次世代電子產品最有可能利用的製造技術之一。在此同時，市場對電子產品的輕量化及小型化的需求也指出了一個以具有可彎曲特性的薄型固態或聚合物基板取代傳統電子元件固態基板的發展趨勢。近期已商業量產的電子紙、太陽能電池、射頻標籤、印刷電池及大面積照明等， 確實印證了這種受到世人注目的多元化發展方向。
