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清華大學 軟性印刷電子實驗室
清華大學 軟性印刷電子實驗室
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Home Research System Integration 系統整合

Research

Topical highlights from the publication list.
主題亮點簡述如下,發表清單則添附於此。

  • Process Optimization 製程優化
  • Device Development 元件開發
  • System Integration 系統整合
[J.62] A 3D profiling system using thermoresistive sensing and image processing with stepwise pixel patching
[J.58] Integrated Automatic Optical Inspection and Image Processing Procedure for Smart Sensing in Production Lines
[J.56] Thermoresistive Profile Sensing Based on Isotropic Strain Detection with Taiji Pattern Routing
[J.54] Machine-learning based characteristic estimation method in printed circuit board production lines
[J.52] Strain visualization in flexible sensors with functional materials: A review
[J.50]Recent advances in flexible force sensors and their applications
[J.49] Smart manufacturing powered by recent technological advancements
[J.47]Electromagnetic characteristic estimation on spiral antennas through AOI, ML, and AI
[J.43] Machine learning-based off-line electrical characteristic prediction through in-line pattern integrity inspection
[J. 37] Efficient and improved qualification method for patterns with irregular edges in printed electronics
[J. 36] Strain sensor with low thermal conductivity concealing resin for enhanced detection sensitivity and improved spatial resolution
[J.32] Continuous inkjet-patterned and flashlight-sintered strain sensor for in-line off-axis detection in roll-to-roll manufacturing
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奈米工程與微系統研究所
軟性印刷電子實驗室

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清華大學 軟性印刷電子實驗室
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